107 - Blogs - Shenzhen Slkor Micro Semicon Co., Ltd.

Brand Ideas of Song Shiqiang from Slkor (4)

Slkor’s GM Song Shiqiang (www.slkormicro.com) always believes marketing is the most important thing of all for a company. He once quoted the words from Ye Maozhong: The essence of marketing is to discover demands. Demands emerge when supply and demand are no longer balanced. With conflict, we will design solutions and invent new products and with products, we must sell them. Products could resolve short-term conflict, while brand could resolve long-term one. Everything is easier after building a brand. Thus, since the founding of Shenzhen SlkorMicro Semicon Co., Ltd. & Shenzhen Kinghelm Electronics Co., Ltd., Mr. Song has always stressed brand building of “Slkor” and “Kinghelm”
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Brand Ideas of Song Shiqiang from Slkor (2)

Shenzhen SlkorMicro Semicon Co., Ltd. and Shenzhen Kinghelm Electronics Co., Ltd. have ushered their fast development in recent years. The popularity and reputation of the two companies’ logos, “Slkor” and “Kinghelm”, have enhanced significantly in electronic information industry, which further improves sales of their products in turn. In the opinions of Song Shiqiang, brand refers to both social and business values that brand owners obtain by using it on an open market. The contents and value that brand conveys to customers have somewhat played an essential role in market competition. Is there any effective way to build a brand? What is the underlying logic of brand building? Mr. Song, the founder of Kinghelm and Slkor, will tell you the answer.
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IDM battle, chip company's "grandson and grandson three generations"

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Mainland electric drive system EMR4 analysis

1. Forewords With the significant acceleration of electric vehicles in the market, the differences between brands, market segments and models are also increasing, and the maximum expansion of the applicability of the electric drive system is more important. Electric -driven systems, such as large -scale EMR3 (third -generation electric drive system) and EMR4 currently developed, are designed at the system level. Compared with the previous generation, EMR4 has improved by up to 5%efficiency, significantly improved power scalability, and greatly reduced costs. Improve efficiency and performance is the technical route and direction proposed by the vehicle to the electric drive system. In order to promote the improvement of EMR4 performance, many chains that affect electrical drive efficiency and performance have been optimized to details. For scalability considerations, many internal and external interfaces have also been marked
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The chip design faces many challenges, but how to solve the problem of IP reuse and integration?

The strong demand for semiconductor chips in the fields of automotive, artificial intelligence (AI), data processing and intelligent terminals has continuously accelerated the development of the semiconductor industry. It is expected that by 2030, it will surge to $ 808.5 billion. , PricewaterhouseCoopers predicts that in 2022, only AI -related semiconductor market revenue will increase to more than $ 30 billion, with an annual growth rate of 50%. At the same time, semiconductor chips have become smaller, faster, and more powerful, and have significantly improved their flexibility and functionality. However, as design becomes more and more complicated, the demand for verification capabilities and next -generation verification technology is also increasing. The functional security compliance that depends on completely traceability and strict document processes becomes more and more important. Semiconductor companies are increasingly adopted IP weight
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What is the difference between the computing amplifier and the comparator

The computing amplifier and the comparator are similar in appearance and schematic symbols. If the logo is polished, it is difficult to distinguish between the two. In addition, many beginners often confuse the computing amplifier with the comparator, because in some applications, the operational amplifier is used as a comparator in many circuits. This article shared these differences. Figure 1 The functional statement of the op amp into the means of the op amp and the comparator's functional statement is as follows. It is an analog chip for signal conditioning. For example, large signals, filtering, reconciliation, etc. The comparator is a circuit that compares an analog voltage signal with a reference voltage. The op amp is used for negative feedback systems, and the comparator is generally used for the opening system, and it can also introduce positive feedback designs to be designed as stagnant comparators.
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What are the causes of MOS tube fever?

It is not detailed enough, but there are generally several types of MOS tube fever: 1. The load is overweight, resulting in the flow of MOS tubes. 2. Promote insufficient incentive signals to cause MOS tube to heat up. 3. The incentive signal is too strong, which will also cause the MOS tube to heat up. Generally, the working temperature of the MOS tube is below 120 degrees Celsius and can work. Generally, it will not exceed 70 degrees.
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How much does SIC and silicon -based IGBT have different efficiency?

Recently, the power electronics are relatively popular, and I will sort out some of the views of some materials. 2022 is a very important year used by Chinese silicon carbide. It is mainly because the 800V system has brought a lot of changes. What are the differences from all levels? I want to discuss with you based on combing materials. First of all, we have to say that IGBT. In fact, I would like to thank Yingfei Ling in the field of electric vehicles. Before European auto companies did not come in, Nissan, Honda and Toyota all developed the inverter around their own technical development. As the core; before importing SIC, Tesla also used single -tube IGBT to make high -power drivers. After Ying Feiling made a standard packaging 6in1 IGBT, it was extremely
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The reliability of the electronic packaging (packaging defect, failure, etc.), this article made a clear narrative!

Electronic devices are a very complicated system, and the defects and faults during the packaging process are also very complicated. Therefore, research on packaging defects and faults require a systematic understanding of the packaging process so that the cause of defects can be analyzed from multiple angles. The mechanism of packaging failure can be divided into two categories: overload and wear. The fault caused by overload is usually instant and catastrophe; grinding loss is long -term damage to cumulative, usually first manifested as a decrease in performance, and then the device fails. The type of failure load can be divided into mechanical loads, heat loads, electric loads, radiation loads and chemical loads. Factors affecting packaging defects and failure are diverse. Material composition and attributes, packaging design, environmental conditions and process parameters will be
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Twenty types of topology of switching power supply

What is topology? The so -called circuit topology is the connection method of power devices and electromagnetic elements in the circuit, and the design of magnetic components, the design of the closed -loop compensation circuit, and the design of all circuit components depends on topology. The most basic topology include Buck, BOOST (BOOST), and Book/Buck, ISOLATED FLYBACK, Positive, Pushing, Bridge Bridge and full bridge converter Essence There are about 14 common topology for switching power topology, each with its own characteristics and applicable occasions. The principle of choosing is to see whether it is high or small power, whether it is high or low -voltage output, and whether the components are as small as possible. Therefore, it is necessary to choose the topology appropriately, and the advantages and disadvantages of different topology and the field of application are very heavy.
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