109 - Blogs - Shenzhen Slkor Micro Semicon Co., Ltd.

Talk about the application and development of electric vehicle IGBT technology

Power devices have appeared in the mid -20th century. After nearly 30 years of development, the combination of MOS and BJT technology has spawned IGBT technology. After continuously updating, IGBT is now widely used in vehicles, welding, aerospace, and other fields. This article introduces the structure and working principle of IGBT, and explains its application in the field of electric vehicles, which helps practitioners to fully understand the IGBT principle and its technological development in the field of electric vehicles. As global warming and the deterioration of the environment have intensified, in order to alleviate the pressure of energy conservation and emission reduction, my country has proposed high goals. In order to achieve the goal of energy conservation and emission reduction, my country has vigorously supported the development of new energy vehicles. The core energy conversion unit traction inverter of the electric vehicle power assembly, which can invert the DC electricity output of the battery to three
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Dry goods | Bambound MOS tube Miller Effect

The following is a switching circuit of NMOS. Step signal VG1 is set to DC level 2V, Fang wave (amplitude 2V, frequency 50Hz), T2's opening voltage 2V, so MOS tube T2 will open and cut off the cycle T u003d 20MS for cycle T u003d 20MS. Switch. First of all, the waveform of VGS and VDS will be used. When you see VGS u003d 2V, there is a small platform. Some people will be curious why VGS will have a small platform when rising? The MOS tube VGS platform brought this question. We tried to change the resistance R1 from 5K to 1K, simulated again, and found that this platform became small and almost gone. Why is this? MOS tube VGS small platform has improved
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"Hualinkona-Semiconductor Craft" Silicon carbide MOSFET Wet treatment in front of the furnace after manufacturing

Introduction to silicon carbide (SIC) device manufacturing technology has many similarities with silicon manufacturing, but whether the differences in materials will affect the cleaning capacity of the cleaning ability. The difference in material parameters includes the diffusion coefficient, surface energy, and chemical bond strength. All of them can play a role in cleaning key surfaces. This work will compare the surface pollution level of 100 mm or 150 mm 4H 4H 4H carbide chips after the contamination of the mercury probe capacitance (MCV). During the MCV period, trace metals such as mercury, iron and nickel were controlled controlled controlled, and a variety of cleaning methods could restore silicon carbide surface to the cleanliness level below 5X1010 atom/CM2. Discuss these cleaning in integrated device processes
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What is the difference between MOS tube and IGBT?

In the electronic circuit, MOS tube and IGBT tube often appear, they can be used as switch components, and MOS tubes and IGBT tubes are also similar in appearance and characteristic parameters. So why do some circuits use MOS tubes, and some circuits use IGBT tube? Let's take a look at what is the difference between the MOS tube and the IGBT tube! There are two main types of MOS pipe field effect tubes, namely the knot field effect tube (JFET) and the insulating grid effect (MOS tube). The MOS tube is MOSFET, and the full name of Chinese is a metal-oxide semiconductor field effect transistor. Because the grid of this field effect tube is isolated by the insulation layer, it is also called the insulating grid field effect tube.
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Differential model filtering and common mode filter analysis

Low frequency comes from two parts: differential molds and common mold filtering. Differential model filtering attempts to reduce the current on the power line of the current back to the line. This means that noise on the power line exists on the shell and line. Therefore, the purpose of filtering is to divert to the circuit before it leaves the shell, so that it can be measured and not measured. Set a inductance on the power line to block it out. At the same time, it provides a capacitor between the power and the circuit line, providing a low impedance channel for noise. Usually with LISN (LINE Impedance Stabilization Network Grid impedance stable network) during business Sometimes the noise may be small, so that no inductance,
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Performance far exceed AMD and apples? Intel 12th Generation Core i9-12900K Evaluation: Toothpaste squeezed, really strong!

On October 28 this year, at the Intel ON Technology Innovation Summit, Intel opened the mysterious veil of the 12th -generation Intel Core processor product family, and launched six new unlocking frequency desktop processors, including global performance outstanding performance Game processor-the 12th-generation Intel Core i9-12900K. With the highest frequency of Rui 5.2GHz and the specifications of as many as 16 cores and 24 threads, the new processor can release higher multi -threaded performance for game enthusiasts and professional creators. The 12th generation Core adopted two CPU cores, one is the performance nucleus (P core), and the other is the energy -effective core (E core). The design of the P core is more traditional. It is the continuation of the Core family. It is optimized for single -threaded and light thread performance. It is suitable for high load games.
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Old driver summary: 11 details of the design of the simulation circuit

The design of analog circuit design requires a solid model of mold electricity and rich experience accumulation. Here, we share the summary of an old -aged engineer to help everyone step on the pits and take less detours in the design. 1. System definition system definition is the basic prerequisite for simulation circuit design. According to the design requirements, analog circuit design engineers need to make corresponding functional definitions on the circuit system and subsystems, and determine the parameter range of related performance such as area and power consumption. 2. The selection of circuit design circuit structure is an important part of circuit design. The simulation circuit design engineer needs to select the appropriate circuit structure according to the functional requirements, design specifications and corresponding parameter indicators according to the need circuit, and determine the component on this basis
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Disassembling report: Teka iron armor 65W nitrogen nitrogen 镓 wireless smart charger

In the past two years, the development of nitride has developed rapidly in the field of consumer power supply. Whether it is a high -cost high -frequency QR anti -excite topology or the main high -performance active pliers, or the LLC for 100 watts of large power, The new products on the market have always emerged endlessly. Of course, the maturity of technology will also make the performance and selling point of the product facing the problem of homogeneity. In order to seek more differentiation of the product, power manufacturers are also racking their brains. For example, recently, the charging head network has obtained a new product launched by Iron Armor to introduce 65W nitrogen 化 fast charging products. In addition to the current mainstream nitrogen nitrogen charger small, portable, high -power output, multi -equipment support, etc., it also adds wireless intelligence to wireless intelligence The interconnection function, the user can connect to the charger through the APP, check and set the parameters of the charger, and let the charger let it
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The characteristics of various topology of switching power supply

Half Bridge Half Bridge ■ Full Bridge Full Bridge ■ Sepic ■ C'UK's basic pulse width modulation waveforms are related to switching circuits. Basic pulse width modulation waveforms are defined as follows: 2. Buck downward voltage characteristics ■ Reduce the input to a lower voltage. ■ It may be the simplest
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Want to replace STM32 with GD32? These details must be known

GD32 is a single chip microcomputer developed in China. It is said that the developer is from ST Company, and GD32 is also made with STM32 as a template. Therefore, GD32 and STM32 are the same in many places.However, GD32 is a different product after all, and it is impossible to follow STM32 for everything. Some self-developed products are still different.We won't talk about the same places. Here are the different places.
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