112 - Blogs - Shenzhen Slkor Micro Semicon Co., Ltd.

Twenty topology of switching power supply

Switch and diode output
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10 Chinese Electric Sciences: PCBA Cold Welding Comprehensive Analysis

I. Overview In the installation of electronic products, the phenomenon of virtual welding has always been the most prominent problem that plagues the reliability of the welding joint work. Especially in high -density assembly and lead -free welding, this phenomenon is even more prominent. Electronic products (including civilian) in history are endless cases of accidents caused by virtual welding.
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Driving Drive Circuit (MOC3040 Application Circle)

Describe a component of a two -way thyroely zero -voltage trigger drive circuit (MOC3040 application circuit). It consists of two parts: input and output. The diode emits sufficient intensity infrared rays under the actual direction of 5 ~ 15ma to trigger output parts. The output part is a silicone light -sensitivity two -way thyristor, which can be turned on in both directions under the action of ultraviolet rays. This device is a six -footed double -column direct -inserted packaging. Its pins configuration and internal structure are shown in the figure below: Some models of the optocoupler bidirectional switch of the two -way thyristor also have zero detectors. It can be triggered when the voltage is zero (close to zero). like
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Introduction to thyristor parameters and models_The Introduction of Common Singles and Bidirection Singles

There is a very high degree of attention to electrical products, and today I want to introduce silicon models. As the use of electrical appliances is becoming more and more frequent, the number of electrical products in our lives also becomes more, and the use of electrical appliances is very harmful to our human body because of electrical energy, so we need to be right Electrical products have a very high degree of attention, and today I want to introduce silicon -controlled models. Please see the introduction of the thyristor model below. Introduction to thyristor parameters and models
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Causes and fault checking methods of components

In the process of using electronic components, it often fails. Facding means that the circuit may fail, which will affect the normal work of the equipment. Here is an analysis of the failure and common failures of common components. Most of the faults in electronic devices are caused by the failure of electronic components. If you are familiar with the failure of the component, the cause of the failure of the component can be locked in time, and the fault can be eliminated in time to allow the equipment to run normally. One of the important factors that cause the failure component failure is the impact of the environmental temperature on the component. The effect of temperature changes on semiconductor devices is greatly affected by the temperature drop of the P-N knot, so P-P-
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IGBT chip brief history (2)

Aluminum and copper's streaming capabilities and heat capacity are far better than aluminum, so IGBT5 allows higher working temperature and output current. At the same time, the chip structure is optimized, and the thickness of the chip has been further reduced. Skills: 175 ° C working temperature, 1.5V saturated voltage, increased output current capacity by 30% because the IGBT5 surface is covered with copper, and in the module packaging
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IGBT chip brief history (1)

It is said that in 2018, the IgBT rivers and lakes have shocked the sixth and seventh -generation heads. They were in the limelight, and people eating melon all guessing the origin of the two heroes. Some good things have sorted out the several generations of the leaders of the Yingjia years, and the leaders of the leaders of the leadership, namely: uh, it seems that who is not clear who is? Uh, although these IGBT "heads" are on the surface It's the same, but they are all stuffy. You can only take off your clothes and perform a "core" dirty surgery. Essence Like this, on the chip, cut a knife to see. It seems a bit different. Story, let's start here.
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Increase 12 times! Is the Japanese SIC technology opened again?

According to Japanese scientific and technological media reports, AIST has developed a high -speed SIC chip polishing technology that can increase speed by 12 times and greatly reduce costs. This technology will soon introduce the integrated processing process of 6 -inch SIC wafers: ▲ Fast speed: Traditional speed speed: Traditional speed speed 50 RPM, new technology reaches 700rpm. ▲ Multi -piece polishing: Traditional methods can only be grinded by single -piece, new technologies can be processed at the same time. ▲ Save ingredients: No grinding liquid, only water. Increase 12 times! High -speed SIC chip polishing costs have a lower time (August), and the Institute of Industry Technology (AIST) announced that they have developed a SIC chip high -speed polishing technology. According to reports, this technology
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What are the most commonly used formulas in the design of 10 power supply? This article helps you sort out clearly

1 --- MOSFET switching tube work to the maximum duty cycle DMAX:
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How to determine the root cause of PCB welding problem?

In the process of printing circuit board manufacturing, the quality of welding quality will directly affect the quality of the entire machine's product. Common weldability problems are: poor wetness, monument, cracks, pores, fake welding, virtual welding, bad tin and slag defects. The reason, what causes the product to occur in such welding failures? This involves the following aspects: 01 whether the quality of raw materials such as welded agents, welds meet the requirements. The performance and quality of raw materials affect the weldability of the product. 02 Impact of welding process. For example, the control of time and temperature, the higher the temperature, the better the temperature, the better, the length of time will affect the formation of the inter -metal compound structure. 03 components
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