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The reliability of the electronic packaging (packaging defect, failure, etc.), this article made a clear narrative!

Electronic devices are a very complicated system, and the defects and faults during the packaging process are also very complicated. Therefore, research on packaging defects and faults require a systematic understanding of the packaging process so that the cause of defects can be analyzed from multiple angles. The mechanism of packaging failure can be divided into two categories: overload and wear. The fault caused by overload is usually instant and catastrophe; grinding loss is long -term damage to cumulative, usually first manifested as a decrease in performance, and then the device fails. The type of failure load can be divided into mechanical loads, heat loads, electric loads, radiation loads and chemical loads. Factors affecting packaging defects and failure are diverse. Material composition and attributes, packaging design, environmental conditions and process parameters will be
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Twenty types of topology of switching power supply

What is topology? The so -called circuit topology is the connection method of power devices and electromagnetic elements in the circuit, and the design of magnetic components, the design of the closed -loop compensation circuit, and the design of all circuit components depends on topology. The most basic topology include Buck, BOOST (BOOST), and Book/Buck, ISOLATED FLYBACK, Positive, Pushing, Bridge Bridge and full bridge converter Essence There are about 14 common topology for switching power topology, each with its own characteristics and applicable occasions. The principle of choosing is to see whether it is high or small power, whether it is high or low -voltage output, and whether the components are as small as possible. Therefore, it is necessary to choose the topology appropriately, and the advantages and disadvantages of different topology and the field of application are very heavy.
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Detailed explanation of the internal design principle and structural analysis of the chip

Summary as a power R u0026 D engineer, of course, often contacts various chips. Some engineers may not be familiar with the interior of the chip. Many students directly enter the application page of the dataset when applying a new chip, and build an external layout based on the recommended design. That's it. In this way, even if the application is fine, the technical details are ignored, and they have not accumulated a better experience for their technical growth. Taking the DC/DC antihypertensive power chip LM2675 today as an example, in detail the internal design principles and structures of the following chips are explained in detail. The typical application circuit of LM2675-5.0 opens the DataSheet of LM2675.
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What are the points of DC-DC's PCB design?

The circuit of DC-DC is much more complicated than LDO, and the noise is greater. The layout and layout requirements are higher. The quality of Layout directly affects the performance of DC-DC, so it is crucial to understand the Layout of DC-DC. 1. Bad Layout EMI, there will be a higher DV/DT on the foot of the SW tube of the DC-DC, and the higher DV/DT will cause a relatively large EMI interference; There will be a relatively large switch noise on the line, and these noise will affect other parts of the circuit; the voltage drops on the wiring, the wiring is too long, it will take
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The common role of 7 MOSFET gate circuits, don't see it!

It is widely used in switching power supply, motor control, electric tools and other industries. The gate is a relatively weak link in MOSFET itself. If the circuit design is improperly designed, it is easy to cause the device and even the system to fail. Therefore, this article will organize this article to organize the circuits common in the gate for your reference discussion. You are also welcome to put forward your own views. The common effects of MOSFET gate circuits are the following points: 1. Remove the noise of coupled between the circuit and improve the reliability of the system.
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Support the manufacturing industry to realize intelligent transformation | GD32F303 universal inverter solution design

In September 2020, my country clarified the goal of carbon peaks in 2030 and carbon neutrality in 2060. The realization of net zero emissions in the next forty years will be a challenging task for China. For the motor industry, the motor occupies an important position in the industrial field. According to statistics, my country's motor consumes 69%of the total electricity consumption of the whole society each year, accounting for about 75%of industrial electricity. Therefore, reducing the carbon emissions during the life cycle of the motor and accelerating the carbon reduction process is an important task facing the motor industry. The frequency conversion speed regulation technology can accurately control the speed of AC motor, and enable the motor to run in the state of energy saving. It is a key measure to regulate the speed regulation of traditional motor systems and improve the operating efficiency of the motor system. Traditional inverter has the characteristics of large volume, low performance, and high price. In addition
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Help sharing power replacement, smart lithium battery BMS solution based on GD32E230

According to statistics, the Chinese market has 300 million two -wheeled three -wheeled electric vehicles. In 2019, my country ’s electric two -wheeled vehicles were 36.09 million vehicles and sold 34.64 million. Heavy user. With the official implementation of the new national standard on April 15, 2019, the sales volume of lithium battery in China reached 6.8 million vehicles, and the penetration rate of lithium batteries in China in my country reached 18.8%. %. In the two -wheeled vehicle industry, lithium batteries have become an inevitable trend, especially in the market, a large number of shared electric vehicles and lithium batteries have appeared in the market, further promoting a large number of smart lithium batteries. Battery management system BA
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SIC MOSFET's interesting IP story set — Bingfeeling half -bag, Romm Shuanglou, residents' grounds, and ge who lying down

Study notes for a silicon carbide chip amateur enthusiast. Literature sorting out, industry news, occasionally obtained, the sky is empty. This public account belongs to personal learning notes, only for personal amateur hobbies, and does not involve any business purposes. If there are irregularities in the article, please forgive me. Some people's hobbies are to raise flowers and grass to sing and fish, and some people like to write Twiter blog vibrato. In recent years, I like to read some books on weekends and brush Paper to see the development of frontier materials and device technology. Title: Do something interesting and do an interesting soul. I talked about a few words of Roman Shuanglou IP.
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Research progress of power electronic packaging key materials and structural design

Abstract: Traditional power electronic packaging is mainly based on two -dimensional plane packaging technologies such as pheasant connection and lead bonds, which cannot meet the reliable applications of third -generation semiconductor devices in high -frequency, high -voltage, and high temperature. In order to solve this problem, the two -dimensional flat packaging has gradually been encapsulated into three -dimensional packaging and development. The research progress of key materials and structural design in power electronic packaging technology is summarized and prospecting. The connection materials have gradually developed from tinyl ingredients to gold -based ravioli, transient liquid oriental connection materials, and high -temperature resistance materials such as sintering silver. The connection technology has gradually developed from the lead key to double -sided cooling, device integration and vertical overlap. Layer interconnection and so on. By removing the drawing performance of the lead, integrate a variety of chips and devices to increase power density, and double -sided cooling improves heat dissipation efficiency. The three -dimensional integration package has huge market potential, which will
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What are the advantages of silicon carbide compared with silicon?

Program. According to the French market research institution Yole D u0026 Eacute; Veloppement estimates that the SIC device market revenue will account for more than 10%of the overall power electronics market by 2025, and the revenue ratio of GAN devices will exceed 2%. Well -known suppliers of SIC components include SEF semiconductors (ST), Cree/Wolfspeed, Rom, Yingfeeling, Ansonmi Semiconductor (on SEMI
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