OIST has designed an EUV lithography technology that exceeds current semiconductor industry standards

Industry Trends|Industry Trends|

2024-08-30 14:39:40 625

According to the latest report from Okinawa Institute of Science and Technology (OIST), their newly designed Extreme Ultraviolet (EUV) lithography technology surpasses current semiconductor manufacturing standards. This new technology features EUV sources that are smaller and consume less power—less than one-tenth of traditional EUV machines—thereby reducing costs and significantly improving machine reliability and lifespan.

Traditional optical systems, such as cameras and telescopes, align optical elements axially, which isn't suitable for EUV light due to its extremely short wavelength and high absorption rate. Instead, EUV light is guided using crescent-shaped mirrors, but this causes the light to deviate from the central axis, reducing optical performance.

To address this, the new technology arranges two axisymmetric mirrors with small central apertures in a linear configuration. EUV light loses about 40% of its energy with each mirror reflection, so traditional systems require about 10 mirrors, with only around 1% of the EUV energy reaching the wafer. By limiting the number of mirrors to four, the new system allows over 10% of the energy to reach the wafer, significantly lowering power consumption.

The core projector of the new EUV technology uses two mirrors to transfer the mask image to the wafer, similar to a telescope. This simple setup, compared to the six mirrors required in traditional systems, was achieved by rethinking optical aberration correction theory, and its performance has been validated by optical simulation software. The team also developed a new “dual-line field” illumination optical method, allowing EUV light to be directed onto the planar mask without disturbing the optical path.

Technical Value Observation

Photolithography machines, also known as mask aligners, exposure systems, or lithography systems, are crucial for semiconductor manufacturing. They use a process similar to photo development to transfer intricate patterns from masks onto silicon wafers. These machines are essential in the semiconductor industry, as photolithography determines the width of semiconductor lines and impacts chip performance and power consumption. The upstream of the photolithography machine industry includes core components and supporting facilities, while the downstream focuses on semiconductor and integrated circuit manufacturing and packaging.

A Japanese university professor has designed an Extreme Ultraviolet (EUV) lithography technology that surpasses current semiconductor manufacturing standards, significantly reducing production costs. This technology is positioned in the upstream segment of the photolithography machine industry chain.

Macro Market Observation

Photolithography machines, also known as mask aligners, exposure systems, or lithography systems, are crucial for chip manufacturing and advanced photoresist development. According to information from Crystal Clear Materials on high-end photoresist R&D, equipment and installation costs account for 69% of the total investment, with photolithography machines representing 44% of this equipment and installation expense.

EUV Lithography Machines Emergence

Over the past decade, photolithography technology has evolved from early G-line (436nm) systems to the latest Extreme Ultraviolet (EUV) lithography machines. This evolution progressed from contact to proximity, and finally to step-and-repeat systems. EUV lithography machines, essential tools for chip production, are core to manufacturing advanced integrated circuits. They are crucial for producing chips with wafer sizes below 5 nanometers, which can only be manufactured using EUV technology.

Global Lithography Machine Sales

The global lithography machine market is highly concentrated, with the top three manufacturers holding over 90% of the market share. From 2015 to 2020, global sales of lithography machines grew overall, reaching 413 units in 2020, a 16.7% increase from the previous year.

Lithography Machine Evolution and Sales

Lithography machines have evolved from G-line and I-line to KrF, ArF, and now EUV technology. In 2020, global sales were dominated by mid-to-low-end products (KrF, I-Line), totaling 264 units and accounting for approximately 65% of the market. High-end EUV machines had 31 units sold, representing about 19% of the total.

ASML Leads the Global Lithography Machine Market

In 2020, Dutch company ASML led the global lithography machine market with a 62% share and 258 units shipped, surpassing Nikon and Canon.

EUV Lithography Machine Pricing

EUV lithography machines, due to their high-tech barriers, are valued at around €150 million each. ASML is currently the only company capable of producing them. Since 2018, the price of ASML's EUV machines has steadily increased, reaching approximately €154 million per unit as of July 4, 2021, equivalent to ￥11.7 billion (using an exchange rate of 1 EUR = 7.6 RMB).

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OIST has designed an EUV lithography technology that exceeds current semiconductor industry standards

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