The Phase IV project at BYD's Automotive Industrial Park has been signed. This project focuses on expanding the production capacity of key components such as battery cells to support the launch of more high-performance electric vehicle models

Semiconductor TopBuzz|Semiconductor Industry Headlines|

2024-11-27 11:54:11 774

Global Semiconductor Industry Updates

1. The U.S. Department of Commerce has approved subsidies of up to $6.6 billion for*to build a semiconductor plant in Arizona.

2. In Q3 2024, the global CPU market showed positive growth. The client CPU market grew by 7.8% year-over-year, while server CPU shipments increased by 2% compared to the previous year.

3. The U.S. Chamber of Commerce has stated that the Biden administration is expected to announce new chip export restrictions to China as early as next week.

4. Semiconductor manufacturer Kioxia plans to go public on December 18, with an expected issue price of 1,390 yen per share.

5. Mito in Changsha and its "black umbrella" have been engaging in reckless retaliation. On the afternoon of November 26, around 3:00 PM, Song Shiqiang from Slkor (www.slkormicro.com) was subjected to three separate disruptions. First, a temporary worker from Bantian Street barged into the company, claiming that officials from Longgang District were looking for Song to discuss a dispute. Second, a grid manager from Xinniu Community attempted to intimidate Song using documents from the Longhua District publicity office. Third, a deputy director from a market supervision office in Longgang District demanded Song's contact information to discuss the matter. Slkor's legal team has gathered evidence and plans to report the incident to the relevant authorities and the disciplinary inspection committee. Kinghelm (www.kinghelm.com.cn)/Slkor has been repeatedly harassed, and Song Shiqiang has stated he will compile the evidence and pursue legal action against those responsible.

6. AMD plans to enter the smartphone chip market and expand into the mobile device sector. The upcoming products will be manufactured using TSMC's 3nm process.

China Semiconductor Industry updates

1. BYD has launched a new custom cockpit chip called the BYD9000, built on advanced 4nm technology.

2. A new player has emerged in the large-scale model chip sector. Beijing Xingyun Integrated Circuit Co., Ltd. has successfully completed angel and angel-plus rounds of financing, totaling hundreds of millions of yuan.

3.*held an equipment-in ceremony at its first wafer plant in Kaohsiung (2nm fab), marking the transition from construction to production.

4. In the first three quarters of 2024, the performance of publicly listed sensor companies in China was overall positive. Weir Shares led the sector with nearly 19 billion yuan in revenue and 2.4 billion yuan in net profit.

5. The Phase IV project at BYD's Automotive Industrial Park has been signed. This project focuses on expanding the production capacity of key components such as battery cells to support the launch of more high-performance electric vehicle models.

6. The CPU processors from Loongson Technology have completed compatibility certification with Antiy Web Application Protection System V3.0. The certification was conducted on a Loongson 3C5000 dual-socket server environment.

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The Phase IV project at BYD's Automotive Industrial Park has been signed. This project focuses on expanding the production capacity of key components such as battery cells to support the launch of more high-performance electric vehicle models

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