Microsoft is developing a new AI large model named MAI-1, which is expected to have over 500 billion parameters

Semiconductor TopBuzz|Semiconductor Industry Headlines|

2024-05-09 11:47:52 716

International News:

1. The Semiconductor Industry Association (SIA) reported that global semiconductor sales in the first quarter of 2024 totaled $137.7 billion, up 15.2% year-on-year but down 5.7% quarter-on-quarter. Sales in March decreased 0.6% compared to the previous year.

2. Intel will partner with 14 Japanese companies, including Omron, to advance back-end process automation, aiming for practical implementation by 2028.

3. Microsoft is developing a new AI large model named MAI-1, which is expected to have over 500 billion parameters.

4. On May 6th, Synopsys announced the sale of its SIG business, with a total deal value of $2.1 billion.

5. Microsoft will host the Build 2024 Developer Conference in Seattle from May 21st to 23rd.

6. In the automotive cloud infrastructure market, public cloud holds a 59% share, with Alibaba Cloud dominating with a 34.5% market share.

7. SoftBank Group is in talks to acquire UK-based AI chip company Graphcore.

8. On April 29th, Kinghelm Electronics (www.kinghelm.net) and Slkor Semiconductor set a record by achieving over one million in sales, the highest single-day revenue in the past two years. They also set another record with a single transaction of 540,000. On April 30th, General Manager Mr. Song Shiqiang instructed the finance department to distribute bonuses to all employees, ranging from 500 to 4,000 yuan based on their tenure, contribution, and expertise.

China News:

1. Recently, the largest SiC power semiconductor manufacturing base in China, the Wuhan Changfei Advanced Semiconductor Base project, successfully completed the first truss hoisting, located in Wuhan, Hubei Province.

2. The first phase of the Henan Zhongyi Chuangxin silicon carbide semiconductor powder production line project has successfully achieved production with 500 tons.

3. The second phase expansion project of Jiangsu Tianke Heda silicon carbide chip is expected to start production in June this year.

4. On May 4th, the Hebei Huici Electronics High Precision Electronic Ceramic Industrialization Project commenced construction in the Zanhuang Economic Development Zone, Hebei Province.

5. On May 8th, the construction of the Shizuishan 800,000 pieces per year 8-inch new energy semiconductor wafer chip smart manufacturing incubation park project started.

6. Recently, the first "S Fund" in Sichuan was established in Chengdu, with a total scale of 1.5 billion yuan, which will fully support the growth and development of local technology companies in Chengdu.

7. Recently, the inauguration ceremony and groundbreaking ceremony of the new site of the Shenzhen Hualiyu High-end Chip Testing Base were held, marking the beginning of a new phase.

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Microsoft is developing a new AI large model named MAI-1, which is expected to have over 500 billion parameters

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