BYD Boosts Capital by 200%, Surging to RMB 9.1 Billion

2025-09-03 16:05:49 193

Global Semiconductor Industry updates

1. China’s silicon wafer market is expected to reach USD 5.867 billion by 2030, with its global market share rising to 23.21%.

2. The top six manufacturers—Shin-Etsu Chemical, SUMCO, GlobalWafers, Siltronic, SK Siltronic, and Soitec—account for about 80% of the global market share, showing a high degree of market concentration.

3. Samsung is expected to launch new mid-to-high-end products, including the Galaxy S25 FE smartphone, tablets, and its first tri-foldable smartphone.

4. In 2024, the world’s top 20 semiconductor companies invested a total of USD 98.68 billion in R&D, up 17% year-on-year, with Intel and NVIDIA ranking first and second.

5. On September 3, Kinghelm (www.kinghelm.com.cn) General Manager Song Shiqiang and Foreign Trade Manager Song Yuanming visited Delta Electronics and Sophia factories for tours and discussions, empowering the company’s high-quality and sustainable growth through the strategies of “bringing in” and “going global.”

6. NVIDIA’s Jetson Thor, with its powerful AI computing capability, has become a key driver in the development of humanoid robots.

China Semiconductor Industry updates

1. BYD underwent an industrial and commercial registration change, increasing its registered capital from RMB 3.039 billion to RMB 9.117 billion, an increase of RMB 6.078 billion, or 200%.

2. The “Self-reliant Chips, United in Zhangjiang — 2025 Tsinghua Alumni Integrated Circuit Forum,” jointly organized by Tsinghua University’s School of Integrated Circuits, the Tsinghua Alumni Association’s Integrated Circuit Committee, and Shanghai Zhangjiang Hi-Tech Park Development Co., Ltd., was held in Zhangjiang, Shanghai, on August 30.

3. In the first half of this year, 227 A-share listed semiconductor companies collectively invested RMB 47.072 billion in R&D, with total revenue of RMB 456.349 billion, resulting in an overall R&D expense ratio of 10.31%.

4. Shaoguang Materials’ high-precision semiconductor and high-generation FPD photomask substrate manufacturing base project is progressing at full speed.

5. DIO Microelectronics officially launched its self-developed eUSB repeater (eUSB2 repeater) product.

6. The second phase of Zhengzhou Hejing’s 12-inch large silicon wafer project is scheduled to be delivered by the end of September this year.

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BYD Boosts Capital by 200%, Surging to RMB 9.1 Billion

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